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Weih Lee

Sherwin Williams Company
Research and Development Scientist
Winner of our 2018 Siltech Best Paper Award
2019 Sidney Lauren Memorial Lecturer

Weih Lee is an R&D Scientist with the Sherwin-Williams Company and the legacy Valspar for four years, focused on development and support of functional powder coatings for the Protective and Marine Division affiliated with the Performance Coatings Group.  Weih's prior experience was with Henkel Electronics Adhesives (the Bergquist Company) as a Senior R&D Engineer formulating thermally conductive polymer coatings, and with Imation Corporation developing a variety of coatings and microcapsules.  Weih received his Ph.D. in chemistry from the University of Minnesota and Masters in Chemical Engineering in Beijing, China.

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