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Wednesday, February 27 • 1:00pm - 1:30pm
The Sidney Lauren Memorial Lecture - Thermal Characterization of Solvent-Free Epoxy Coatings by Rheology and Kinetics Combined - Sherwin Williams

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Abstract
Thermal Characterization of Solvent-Free Epoxy Coatings by Rheology and Kinetics Combined

Rheology and kinetics are a pair of indispensable attributes to define thermally reactive coatings and paints.  In this work, VOCs-free epoxy coating cure paths under heat are characterized via viscoelastic and kinetical behaviors with functional powder coating formulations as examples.  As a result, what the gel point, the minimal complex viscosity (h*min) and the shear moduli G’ & G’’ from rheological curves, and as well the maximal cure rate (ȧmax or damax/dt) and the peak temperature (Tpeak) out of differential scanning calorimetry (DSC) exothermic profiles essentially mean when it comes to an application-oriented formulation are quantitatively interpreted with respect to dynamic modulus, viscosity, and the instant extent of cure (a).  Events of vitrification and de-vitrification in a cure process are pertinently observable for high glass transition temperature (Tg) epoxy matrix coatings unless a fast enough heating rate (b) to a high enough temperature is employed.  Complete cure description provides strong insights into product developments allowing particular flow and cure properties balanced to boost line performance, applicable to nearly all B-staged thermosetting systems of 100% solids such as conditioned prepregs, adhesives and underfills besides epoxy-based liquid, e-coat, and powder primers or overcoats.

Speakers
avatar for Weih Lee

Weih Lee

Research and Development Scientist, Sherwin Williams Company
Winner of our 2018 Siltech Best Paper Award2019 Sidney Lauren Memorial LecturerBiographyWeih Lee is an R&D Scientist with the Sherwin-Williams Company and the legacy Valspar for four years, focused on development and support of functional powder coatings for the Protective and Marine... Read More →



Wednesday February 27, 2019 1:00pm - 1:30pm CST
Astor Grand Ballroom C - 2nd Floor